Printed circuit board fabrication processes and architecture including point-of-use design and fabrication capacity employing additive manufacturing

ABSTRACT

Apparatus and methods are provided which enable a capacity to remotely enable research, development, and production tasks to be done at a point of use (POU) as well as permitting some design tasks to be done remotely with manufacturing employing, for example, additive manufacturing (AM), for printed circuit boards (PCB) as well as other electrical items. In particular, some embodiments are directed towards facilitating POU on-site manufacturing capacity with a remote or distributed requirements/design process.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional of co-pending U.S. Pat. No.10,070,532, issued Sep. 4, 2018, entitled “PRINTED CIRCUIT BOARDFABRICATION PROCESSES AND ARCHITECTURE INCLUDING POINT-OF-USE DESIGN ANDFABRICATION CAPACITY EMPLOYING ADDITIVE MANUFACTURING,” the disclosureof which claims priority to the now-expired U.S. Provisional PatentApplication Ser. No. 62/153,935, filed Apr. 28, 2015, entitled “PRINTEDCIRCUIT BOARD FABRICATION PROCESSES AND ARCHITECTURE INCLUDINGPOINT-OF-USE DESIGN AND FABRICATION CAPACITY EMPLOYING ADDITIVEMANUFACTURING,” the disclosure of which is expressly incorporated byreference herein.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

The invention described herein was made in the performance of officialduties by employees of the Department of the Navy and may bemanufactured, used and licensed by or for the United States Governmentfor any governmental purpose without payment of any royalties thereon.This invention (Navy Case 200,526) is assigned to the United StatesGovernment and is available for licensing for commercial purposes.Licensing and technical inquiries may be directed to the TechnologyTransfer Office, Naval Surface Warfare Center Crane, email:Cran_CTO@navy.mil.

BACKGROUND AND SUMMARY OF THE INVENTION

The present invention relates to a capacity to remotely enable research,development, and production tasks to be done on site or permit up to alltasks except manufacturing to be done remotely employing, for example,additive manufacturing (AM) for printed circuit boards as well as otherelectrical items. In particular, some embodiments are directed towardsfacilitating point-of-use (POU) on-site manufacturing capacity with aremote or distributed requirements/design process.

Supplying electrical and other types of similar equipment such asprinted circuit boards (PCB) to remote or POU locations face a varietyof challenges. One factor is acquisition lead time—once concept designis complete, obtaining prototypes for testing and evaluating is timeconsuming and difficult in remote locations. Various specialties neededto conduct requirements analysis, as well as designing, producing,testing, and manufacturing various components, are frequently not foundin one location. Another factor is that PCBs require extensive dedicatedPCB fabrication facilities because PCB fabrication is a specializedprocess with industry unique equipment and materials. A current approachto production of PCBs cannot be accomplished at or on temporary ormobile locations, such as ships, land vehicles, construction sites,spacecraft, underwater facilities, ocean oil wells, or Antarcticlocations or shelters, etc. Another problem with manufacturing PCBs offsite includes transportation logistics (such as shipping andwarehousing). Thus, a need exists for manufacturing PCBs at POUlocations, while at the same time, shortening design and productiontime, and reducing facilities and materials.

AM is being examined to solve these problems. However, there stillremain many technical difficulties and gaps in AM capabilities andequipment. For example, no AM system exists that can produce astart-to-finish electrical system or component, such as a PCB, at a POUlocation.

Another challenge is that technical development relative to AM and PCBshas focused on production of PCB additive materials that are createdwith single-use AM printers, which are not suitable formultiple-application use. In other words, single-use AM printers aresimilar to a particular manufacturer's inkjet printer, where ink andcartridge designs are specific to the manufacturer—they can't be usedfor other applications, such as creating tattoos or painting buildings.Many technical problems were discovered during attempts to use generaluse or mechanical part AM printers with an embodiment of the invention.For example, general use AM systems have different print resolutions andare not ideal for PCB manufacturing. Additionally, process parametersfor time and temperature for sintering conductive paste withoutdegrading substrate material was a substantial challenge.

According to an illustrative embodiment of the present disclosure,processes and systems to remotely enable research, development, andproduction tasks to be done on site or permit up to all tasks exceptmanufacturing to be done remotely employ additive AM to manufacture PCBsand other electrical items. Additionally, exemplary embodiments ofsystems and processes disclosed in this application provide forfacilitating POU or on-site manufacturing capacity with a remote designprocesses.

According to a further illustrative embodiment of the presentdisclosure, another embodiment may include processes and systems forfacilitating remote or distributed requirements gathering to includemission, capability, operational, interoperability, and systemengineering requirements data gathering/analysis, generating ofrequirements documents and technical data, software, data files followedby design, development, generating required model based engineering(MBE) or digital production files, sending such files via a securesystem for POU manufacturing, as well as operational test and evaluationsteps. Embodiments can also include a combination of equipment thatcollectively reduces a number of required manufacturing and testequipment needed to provide some aspects of utility associated withembodiments of the invention. Manufacturing and testing systems caninclude automated systems as well as use of a combination of manual andautomated systems.

Another exemplary embodiment provides a capability to produce emergencyrepair equipment or spare parts, which do not have to have the samedegree of reliability but can provide a temporary or interimfunctionality while a more robust part is produced. Likewise, anotherutility that an embodiment of the invention provides is enabling aresponse to a situation where a system needs to have an on-the-spot orimmediate upgrade in capability at an on-site, POU location.

Additional features and advantages of the present invention will becomeapparent to those skilled in the art upon consideration of the followingdetailed description of the illustrative embodiment exemplifying thebest mode of carrying out the invention as presently perceived.

BRIEF DESCRIPTION OF THE DRAWINGS

The detailed description of the drawings particularly refers to theaccompanying figures in which:

FIG. 1 show a simplified process for executing various steps inaccordance with an exemplary embodiment of the invention;

FIG. 2 shows a cross-section of a simplified AM output product of anembodiment of the invention produced from an exemplary process such as,e.g., at FIG. 1;

FIG. 3 shows the FIG. 2 cross-section after use of at least a portion ofan exemplary process for applying an electrical paste into cavities inthe AM output or product to create electrical conductive paths in the AMoutput;

FIG. 4 shows the FIG. 3 cross-section after use of at least anotherportion of an exemplary approach for applying pressure to the FIG. 3conductive paste to create electrical conductive paths in the AM outputproduct;

FIG. 5 shows the FIG. 4 cross-section after use of at least anotherportion of an exemplary approach employing a drill to create electricalconductive paths in the AM output product;

FIG. 6 shows a table showing various properties of different materialsused with exemplary embodiments of the invention;

FIG. 7 shows another table showing various properties associated withdifferent electrical conductive materials used with exemplaryembodiments of the invention;

FIG. 8a shows an image of a POU location such as a ship;

FIG. 8b shows an image of a POU location such as a vehicle;

FIG. 9 shows an image of another POU location such as a vehicle withcommunications, illustrating transmission of design data to POU formanufacturing;

FIG. 10 shows an exemplary layout of equipment in an accordance with anexemplary embodiment of the invention;

FIGS. 11A-11E show another exemplary process in accordance with aspectsof an exemplary embodiment of the invention;

FIGS. 12A-12C show another exemplary process in accordance with aspectsof an exemplary embodiment of the invention;

FIG. 13 shows an exemplary design output from PCB computer aided design(CAD) software which illustrates one exemplary data file structure(e.g., RS274X) for an exemplary three dimensional (3D) PCB design;

FIG. 14 shows an exemplary view of a 3D conductor layout that is a partof an exemplary 3D PCB design created in part using exemplary FIG. 11Bprocesses (e.g., FIG. 11B, step 319J) and exemplary PCB CAD softwarederived from or based on the exemplary 3D PCB design shown in FIG. 13;

FIG. 15 shows an exemplary view of a 3D substrate associated withexemplary 3D PCB design, e.g., FIG. 13 substrate, created via exemplaryprocessing, e.g., in FIG. 11C step 319V; and

FIGS. 16A and 16B show an exemplary view of an exemplary 3D PCBstructure created by combined elements of FIG. 14 and FIG. 15 where theexemplary 3D PCB structure is described and provided as astereo-lithographic (STL) file output to the AM system, e.g., an AMprinter.

DETAILED DESCRIPTION OF THE DRAWINGS

The embodiments of the invention described herein are not intended to beexhaustive or to limit the invention to precise forms disclosed. Rather,the embodiments selected for description have been chosen to enable oneskilled in the art to practice the invention.

Referring initially to FIG. 1, a simplified process for executingvarious steps in accordance with an exemplary embodiment of theinvention is shown. At step 101, an exemplary process is started basedon receipt of a request for engineering and production support at POUlocation. At step 103, a design effort is accomplished, which includes arequirements analysis process that can be done at a remote site based onthe step 101 request as well as collecting additional information frominterviews of experts at a remote design site, such as an engineeringsupport center communicating with the POU location personnel. Inparticular, one example of design steps at step 103 for a two-sideddesign may include creating AM output product design having a substrateincluding apertures, such as “trenches” for conductors and “holes” forlayer-to-layer interconnects within the substrate. Design steps may becreated using one or more CAD tools which output, such as RS274X, ODB++or IPC-2581format outputs which are then imported into a PCB computeraided manufacturing (CAM) software (e.g., CAM350 or Valor); next,panelize as necessary; then output design format interchange (DFX)format files for each conductor/pad layer and drill location layer andthen import the DFX format files into a mechanical CAD; next, createsubstrate block, subtract conductor layers with depth extruded on eachside, subtract holes through the substrate, subtract pads with depthextruded on both sides of hole. At step 104, a Stereo-Lithographic (STL)file is generated based on inputs and data from the design step 103using a 3D mechanical CAD software tool. At step 105, based on inputs,such as the STL file, an AM machine is used to engage in AM productionactivities to create an AM output product (e.g., see FIG. 2), such as anelectrical system dielectric substrate with various apertures (e.g.trenches and holes) formed from the AM manufacturing process. ExemplaryAM production activities can include Digital Light Processing (DLP),Selective Laser Sintering (SLS), and Multi-Jet-Modeling (MJM). Exemplaryprocesses can use DLP, SLS or MJM to fabricate a PCB substratestructure. For example, the ProJet 3510 HDplus 3D Printer from 3DSystems is such an AM printer utilizing MJM process for high definitionprinting. At step 107, engaging in a first sequence of post processing,such as specific solvent wash processes required to remove supportmaterials as a byproduct of step 105 and elevated temperature post cureor heat treat with a prescribed cool down rate under pressure to preventsubstrate distortion, or an elevated temperature bake followed by animmersion in an ultrasonic water bath at elevated temperatures to removewax-based support materials. At step 109, engaging in a print conductiveink process, for example, using conductive inks for conductors andplating which creates electrical circuits or patterns on one or morelayers or surfaces of the AM output product. An example conductive inkproduct could include Ormet 265 Sintering Paste. An exemplary conductiveink or paste can include a conductive material, e.g., a metal such ascopper and a binding matrix that tightly binds the metal or conductivematerial that can be applied in a liquid or paste form and which hardens(e.g., via sintering or thermally hardening). At step 109, pushing anelectrically conductive paste or ink into the apertures of the AM outputproduct using, e.g., a flexible squeegee structure having a durometer ofseventy or higher at step 141 of FIG. 3. Another method is an exemplarydesign for a mechanism which utilizes a bladder expanded by air pressure(e.g., see FIG. 4) for pushing the conductive ink into the AM apertures.The conductive paste or ink may be inserted into a container thatembodies a rubber bladder on one end and an orifice on the other. Airenters the container and pneumatically pushes conductive paste or inkthrough the orifice to an AM surface. The apertures in the AM substrate127, 129 and 133 of FIG. 2 become filled with the conductive paste orink in step 109, shown as filled in 145 and 147 of FIG. 3. At step 111,engaging in another sequence of post processing the conductive paste orink, such as applying a precise temperature on the paste/substrateoutput of step 109 in a vacuum oven or inert gas atmosphere for aspecific dwell time in order to prevent degradation of the substratematerial, using a mechanism adapted for elevated temperature in avacuum, curing or sintering the paste into the structures or cavities inthe AM output product and subsequently removing excess material from thesurface through mechanical abrasion. For example, in the case ofcombining the Ormet 265 Sintering paste used in step 109 and the VisiJetM3 X dielectric substrate AM output from step 105, step 111 can becomprised of applying a precise temperature ramp rate of +4° F. perminute from room ambient to 365° F. to the paste and substrate, holdingat 365° F. for a dwell time of 20 minutes, and then decreasing appliedtemperature at a rate of −4° F. per minute to room ambient all while ina vacuum chamber at an applied pressure of 50 psi. At step 113, adrilling operation on the AM output product occurs. For example,drilling can include drilling through the conductive paste filledapertures with a drill bit diameter smaller than the AM output productcavity diameter, such that a thin wall of conductive paste remains inthe AM output product cavity, which emulates a plated through hole formounting through-hole components, connectors, or grounded mountingholes, creating features suitable for traditional mechanical mounting ofleaded electronic components. Milling or laser ablation may also be usedto remove either substrate material, paste, or conductive ink to createpatterns, features, etc. Conductive ink or other conductive materials orinsulating material may be filled in holes, trenches, ablated sections,etc. At step 115, a final mounting of electronic components, as definedby the design in step 103, is performed using tin/lead solder orconductive epoxy to mechanically fix the electronics components andcreate electrical connection between the electronic components to theoutput of step 113 in order to complete an electrically functional PCBassembly.

Referring to FIG. 2, an illustration of a PCB substrate 131 is shownthat has been formed by design and AM processes such as described hereinprior to application of conductive paste or ink. The PCB substrate 131is formed with a plurality of apertures or gaps 127, 129, 133. A laseror UV light source 122 and scanner system 123 is positioned and employedto perform a variety of processing steps on the PCB substrate 131 (e.g.,curing raw resin of the PCB substrate 131 to harden it after AM processbuild-up).

FIG. 3 shows the FIG. 2 PCB substrate 131 cross section after use of atleast a portion of an exemplary process and system to apply anelectrically conductive paste 143, into apertures or gaps, such as 133,in evolving AM output or product to create electrically conductivesections 145 and 147 in the AM output product in accordance with anembodiment of the invention. One approach can include use of a squeegee141 which presses the conductive paste 143 or ink into the plurality ofapertures or gaps 127, 129, 133 (e.g., see FIG. 2) to form theelectrically conductive sections 145 and 147, while leaving someapertures or gaps, such as 133, without paste. Application of theelectrically conductive paste 143 or ink can be an automated or manualprocess.

Referring to FIG. 4, an illustration of an alternative method ofapplication of conductive paste and/or ink to form the electricallyconductive sections 145 and 147 using a pneumatic device 149 to push theelectrically conductive paste or ink to fill apertures or gaps 133 inthe PCB substrate 131.

Referring to FIG. 5, an illustration of an exemplary drill process isshown, where a controlled drill machine 153 can be used to drill a hole155 through the paste or ink filled into one or more electricallyconductive sections, e.g., 147, to form a through-hole in hardened inkor paste in the electrically conductive section 147. This structureprovides access for mounting “through hole” electronic components intothe PCB substrate 131 design.

Referring to FIG. 6, a variety of properties 171 can be considered inselecting materials used in various embodiments. Properties 171 areshown such as dielectric constant, dissipation factor, dielectricstrength, water absorption, melt temperature, flame retardant, CTE(Z),etc. are examined with respect to materials or parameters such as FR4173, Nylon 12 175, ABS 177, and units 179 associated with the variousvalues. With respect to FIG. 7, additional properties 181 can includeconductor material, sheet resistivity, cure, CTE, working life, shelflife, storage condition and equivalent width are provided with respectto various types of conductors 183 such as silver, copper, copper/tin aswell as foil 185, which are shown with their respective units 187 forexemplary numerical values listed in FIG. 7.

FIGS. 8a, 8b and 9 show POU platforms such as a ship 201 in FIG. 8a orvehicle 202 in FIGS. 8b and 205 in FIG. 9 where an embodiment of theinvention, e.g. 207, can be mounted, used, with specific application ata particular POU.

Referring to FIG. 10, an exemplary layout of equipment in an accordancewith an exemplary embodiment of the invention illustrates a compact area211 where an exemplary AM 3D printer 210, curing and/or post processoven 213, print equipment 215, drill machine 217 and storage unit 219can be contained in an area less than 250 square feet in contrast toexisting facilities which requires an area of thousands of square feet,e.g. 16,000 square feet. Some benefits or aspects to this embodimentillustrates an ability to manufacture a PCB at POU locations where spaceand material availability are limited and where mobility of anon-stationary platform is necessary such as, for example, locations asillustrated in FIGS. 8a, 8b and 9. FIG. 8a illustrates shipboardinstallation, 201 where size, weight and material storage availabilityis limited and where mobility such that the traditional PCBmanufacturing methods of FIG. 1 would not be possible. FIG. 8billustrates the application of a layout as applied to a ground mobilesystem, 202 where the layout illustrated in FIG. 10 may be utilized in amoving vehicle. Of critical importance in some embodiments can includean ability of embodiments of the invention to be utilized in a compact,mobile environment and serve multipurpose point of use manufacturingroles whereas the prior art utilizes equipment and materials (i.e. tanksfilled with reactive liquid chemistry) not amiable to installment in aspace limited, mobile POU environments. Additionally regarding FIG. 10,exemplary AM 3D printer 210 and curing and/or post process oven 213 canbe utilized for a variety of machine part fabrication not dedicated tomanufacture of a PCB providing flexibility of use for, e.g., the layoutof FIG. 10.

Referring to FIGS. 11A-11E, an exemplary process for conversion of PCBCAD software data output into an STP file for use in forming a PCBsubstrate. At FIG. 11A, Step 303: Create a first printed circuit board(PCB) design with electronic CAD tools on a PCB design and manufacturingcomputer (PCBDMC) with a software read/write hard drive, display,input/output system, processor, etc at a point of use (POU) or a remotelocation and saving resulting first data into a first data file (PCBdata e.g., a Gerber file such as a RS274X, ODB++, or IPC-2581 formats),comprising a plurality of first data including electrical componentfootprints comprising electrical interfaces and PCB design elementscomprising interconnection lists (net list), pad stacks, the PCB designprofile geometry including the electrical component footprints (e.g., X,Y locations of conductive pad and conductor line shapes), and electricalcomponent hole diameters associated with the conductive pad shapelocations. Referring to FIG. 11B: Step 305: At the POU, executing CAMsoftware and generating a second data and second data file comprisingthe first data in said first data file to a computer aided manufacturing(CAM) software, e.g., (CAM 350 by Downstream, Genesis by Valor, etc usedfor generating, designing, and manipulating PCB data) on the PCBDMC andthen executing the CAM software on said first data, said CAM softwarecomprising a Design Rule Check (DRC) and a Design for Manufacturability(DFM) analysis software comprising a plurality of DRC rules and DFMrules adapted to search for specified or predetermined PCB designelements associated with one or more PCB additive manufacturing (AM)design flaws or risks in one or more DRC and DFM rules in said firstdata (e.g., if A and B AM PCB element(s) design flaws are matched in thefirst data, then generate one or more DRC or DFM flags comprising one ormore specific AM design risk or flaw warning and accompanying said PCBdesign elements triggering the rule execution) where the CAM softwarerules are executed by a rule engine in said DRC and DFM analysissoftware on said first data, the CAM software generating said seconddata comprising said one or more design risk or flaw warnings associatedwith respective first data PCB elements having said one or more designrisk or flaws, wherein processing can continue either by reopening saidfirst data file in said CAD tools and altering the first data to changethe first PCB design to eliminate the design risk or flaws thenrepeating step 305 or executing the CAM software that further comprisesa module that provides a user interface to enable changes to the firstdata file to eliminate the design risks or flaw warnings, thengenerating a second data file comprising a modified AM optimized PCBdesign including said altered first data having first PCB elements withdesign risks or flaws removed comprising information and file elementssuch as shown in, e.g., FIG. 13. Step 307: Panelizing and saving saidmodified AM optimized PCB design comprising, e.g., elements shown orassociated with elements in FIG. 13, for manufacturing with an AM system(step and repeat parts in an array structure optimizing utilization)using the CAM software on the PCBDMC so as to place the modified AMoptimized PCB design elements on different AM plate sections of the AMsystem into the second data file. Referring to FIG. 11C: Step 308:Outputting the second data file comprising a DFX format for eachconductor/pad layer and electrical component drill hole element in themodified AM optimized PCB design creating a third data file wherein theDFX format of the third data file comprising separate PCB layers eachfor top conductor elements of the modified AM optimized PCB design, toppad elements of the modified AM optimized PCB design, bottom conductorelements of the modified AM optimized PCB design, bottom pad elements ofthe modified AM optimized PCB design, plated through-hole elements ofthe modified AM optimized PCB design that conductive paste is to bedisposed within, PCB tooling hole elements of the modified AM optimizedPCB design that conductive paste is not to be disposed within and PCBprofile elements. Step 309: Importing the third data file comprising theDFX format file consisting of the separate PCB layers data to amechanical CAD tool wherein as an inherent result of importing said topconductor elements of the modified AM optimized PCB design, top padelements of the modified AM optimized PCB design, bottom conductorelements of the modified AM optimized PCB design, bottom pad elements ofthe modified AM optimized PCB design, plated through-hole elements ofthe modified AM optimized PCB design that conductive paste is to bedisposed within, PCB tooling hole elements of the modified AM optimizedPCB design that conductive paste is not to be disposed within and PCBprofile elements are changed to blocks. Step 315: Within the mechanicalCAD tool, modify the third data file comprised of the modified AMoptimized PCB design, top pad elements of the modified AM optimized PCBdesign, top conductor elements of the modified AM PCB design, bottomconductor elements of the modified AM optimized PCB design, bottom padelements of the modified AM optimized PCB design, plated through-holeelements of the modified AM optimized PCB design that conductive pasteis to be disposed within, PCB tooling hole elements of the modified AMoptimized PCB design that conductive paste is not to be disposed withinand PCB profile elements in block and polyline form by applyingmechanical CAD tool functions to revert the blocks and polylines intothe plurality of the modified AM PCB design elements. Referring to FIG.11D: Step 319A: Within the mechanical CAD tool, modify the third datafile comprised of the modified AM optimized PCB design, top pad elementsof the modified AM optimized PCB design, top conductor elements of themodified AM PCB design by applying mechanical CAD tool functions ofextrusion and/or pulling associated with the plurality of top padelements of the modified AM optimized PCB design, top conductor elementsof the modified AM PCB design such that the modified AM optimized PCBdesign elements are attributed thickness as prescribed by t1 and z=t−t1(refer to FIG. 2). Step 319B: Within the mechanical CAD tool, modify thethird data file comprised of the modified AM optimized PCB design,bottom pad elements of the modified AM optimized PCB design, bottomconductor elements of the modified AM PCB design by applying mechanicalCAD tool functions of extrusion and/or pulling associated with theplurality of bottom pad elements of the modified AM optimized PCBdesign, bottom conductor elements of the modified AM PCB design suchthat the modified AM optimized PCB design elements are attributedthickness as prescribed by t2 and z=0 (refer to FIG. 2). Step 319C:Within the mechanical CAD tool, modify the third data file comprised ofthe modified AM optimized PCB design, plated through-hole elements ofthe modified AM optimized PCB design that conductive paste is to bedisposed within by applying mechanical CAD tool functions of extrusionand/or pulling associated with the plurality of plated through-holeelements of the modified AM optimized PCB design such that the modifiedAM optimized PCB design elements are attributed thickness as prescribedby t and z=0 (refer to FIG. 2). Step 319D: Within the mechanical CADtool, modify the third data file comprised of the modified AM optimizedPCB design, PCB tooling hole elements of the modified AM optimized PCBdesign that conductive paste is not to be disposed within and PCBprofile elements by applying mechanical CAD tool functions of extrusionand/or pulling associated with the plurality of PCB tooling holeelements of the modified AM optimized PCB design that conductive pasteis not to be disposed within and PCB profile elements modified AMoptimized PCB design such that the modified AM optimized PCB designelements are attributed thickness as prescribed by t and z=0 (refer toFIG. 2) and save to a forth data file. Referring to FIG. 11E: Step 319P:Apply mechanical CAD tool functions to combine the modified AM optimizedPCB design of the third data file comprised of the top pad elements ofthe modified AM optimized PCB design, top conductor elements of themodified AM PCB design, bottom conductor elements of the modified AMoptimized PCB design, bottom pad elements of the modified AM optimizedPCB design, plated through-hole elements of the modified AM optimizedPCB design that conductive paste is to be disposed into a combined AMoptimized PCB design conductor element (refer to FIG. 14). Step 319Q:Apply mechanical CAD tool functions to subtract combined AM optimizedPCB design conductor element third data file output of step 319Q fromsaid modified AM optimized PCB design elements forth data file outputfrom step 319D and save to the fifth data file (refer to FIG. 16). Step319X: Taking the fifth data file outputting its data into a sixth datafile comprising a mechanical CAD system format comprising aStereo-Lithographic (STL) file. Step 321: Additively manufacturing afirst substrate block based on the sixth data file comprising the STLfile with structure comprising a plurality of AM optimized PCB designelements. Step 323: Applying conductive paste into at least some ofmodified AM PCB design elements comprised of the top pad elements of themodified AM optimized PCB design, top conductor elements of the modifiedAM PCB design, bottom conductor elements of the modified AM optimizedPCB design, bottom pad elements of the modified AM optimized PCB design,plated through-hole elements of the modified AM optimized PCB designthat conductive paste is to be disposed into a combined AM optimized PCBdesign conductor element in said first substrate block

Step 325: Drilling holes into at least one of said electrical componenthole diameters associated with the conductive pad shape locations filledwith conductive paste to form apertures in the paste. Step 327:Attaching electronic components to said first substrate block at saidelectrical component footprints comprising electrical interfaces usingconductive adhesive or solder material.

Referring to FIG. 12A, Step 401: At a point of use (POU location),determining a plurality of electrical component footprints includingform and fit of one or more electrical interfaces of the plurality ofelectrical components and using a PCB design system including aprocessor, storage medium, input/output system, display, etc andcreating a first data file (e.g., a Gerber file) that is an output ofPCB design software in a first format comprising a plurality of dataelements, e.g., in a RS274X, ODB++, or IPC-2581 format, that are at X, Ylocations of each of the one or more electrical interfaces in a PCBsubstrate design as well as PCB element shapes comprising a firstplurality of conductor shape representations and first plurality ofconductor pad shape representations in a 2 dimensional format andstoring the first data file on a machine readable data storage medium,wherein each said first plurality of conductor pad shape representationsare associated with one of the electrical interfaces. Step 403: Usingthe PCB design system for converting the first data file to second datafile comprising a second format, e.g., a DXF file, comprising a datainterchange file, a description of PCB layers in a differentexchangeable format, blocks converted from said conductor pad shaperepresentations, poly lines converted from said conductor shaperepresentations, and storing the second data file on a machine readabledata storage medium. Step 405: Using the PCB design system for importingthe second data file, e.g., DXF file, into a computer aided designsystem, e.g., AUTOCAD 3D®, then manipulating creating a third data filewith third data file elements comprising steps including converting theblocks into respective second conductor pad shape representations, polylines into respective second conductor shape representations, performextrusions and/or other AUTOCAD pulls on the second conductor pad shaperepresentations as well as the second conductor shape representations,and saving the third data file elements into the third data file.Referring to FIG. 12B: Step 407: Using the PCB design system forcombining and saving the second conductor shape representations and thesecond conductor pad representations in the third data file into aplurality of respective 3D conductor line shapes data and 3D conductorpad shapes data then associating each 3D conductor line shapes data andeach 3D conductor pad shapes data with a respective Z axis of one ormore respective PCB layers into the third data file. Step 409: Using thePCB design system for combining and saving a plurality of non-conductivefeatures of the PCB substrate design, e.g., drill electrical componenthole locations in the PCB substrate design to be filled with conductivepaste and various tooling holes in the PCB substrate design not to befilled with the conductive paste, together into a basic PCB substrateform into the third data file. Step 411: Using the PCB design system forcombining and saving the basic substrate form and the plurality ofrespective 3D conductor line shapes data and the plurality of 3Dconductor pad shapes data associated with the respective Z axis of oneor more respective PCB layers into the third data file. Step 413: Usingthe PCB design system for converting the third data file into a fourthdata format and outputted the fourth data format into an additivemanufacturing (AM) data file, e.g. a STL file. Step 415: Using an AMsystem to form and produce a PCB substrate at the point of use based onthe AM data file with structures comprising a plurality of apertures orvoids in said substrate wherein each said apertures or voids are formedbased at least on the plurality of 3D conductor pad shapes dataassociated with the respective Z axis of one or more said respective PCBlayers. Referring to FIG. 12C: Step 417: At the point of use, applyingthe conductive paste into at least some said plurality of apertures orvoids in said PCB substrate and hardening the conductive paste by e.g.,hardening the conductive paste by, e.g., sintering via a laser or otherhardening system or process. Step 419: At the point of use, drilling theelectrical component holes into at least one of said conductive pastewithin one or more of the apertures or voids. Step 421: Installing andelectrically bonding the electrical interfaces of the electricalcomponents into the electrical component holes in the PCB substrate andinstalling the PCB substrate with installed said electrical componentsinto an end item configuration system at the point of use.

Referring to FIG. 13 illustrates a typical output of a simplified viewof a PCB CAD design software with file structure created in accordancewith one embodiment of the invention. Various files 501 are shown whichcan be used in an exemplary embodiment are shown on the left hand sideof the figure. A substrate 511 is shown with devices 525, 227, installedwith electrical components. Layers, pads, conductors, drill sites, andprofile are shown.

Referring to FIG. 14 shows an exemplary view of a graphical depiction ofa combined 3D conductor model file. The view included conductivestructures e.g. 512.

Referring to FIG. 15 shows an exemplary view of one substrate 3D modelfile modeling a substrate 511.

Referring to FIGS. 16A and 16B an exemplary view of the 3D PCB modelcreated with an exemplary process by combining the negative of thecombined 3D conductor file with the substrate 511 3D model file.

Although the invention has been described in detail with reference tocertain preferred embodiments, variations and modifications exist withinthe spirit and scope of the invention as described and defined in thefollowing claims.

1. A method of manufacturing comprising: determining a plurality ofdesign attributes for a printed circuit board (PCB) that fulfillsrequirements at a predetermined point of use (POU) where the PCB will bemanufactured and installed or used and recording said plurality ofdesign attributes on a first recording medium section; providing a firstand second design software system, an additive manufacturing (AM) systemcomprising at least a first laser, and an oven for receiving andprocessing the PCB as it is manufactured at the POU on a mobileplatform; creating a first PCB design based on said plurality of designattributes from said first recording medium using the first designsoftware and saving an output from said first design software in a firstdata file within a second recording medium section comprising aplurality of two dimensional (2D) PCB structure data attributes;altering the first data file stored on the second recording medium toadd three dimensional (3D) PCB structure data attributes to the firstdata file contents and saving the altered first data file contents intoa second data file on a third recording medium; inputting the seconddata file into the AM system and manufacturing a substrate using the AMsystem based on the second data file, said substrate comprising aplurality of apertures comprising apertures associated with electricalconductive paths and pads; applying a conductive paste to said pluralityof apertures associated with said electrical conductive paths and pads;applying pressure on said conductive paste to force said paste into allareas of said apertures associated with said electrical conductive pathsand pads; placing said substrate into said oven during a specifictemperature rise, hold and fall profile under said pressure to performpost processing on said substrate and said paste to further form saidsubstrate and paste into a predetermined hardened conductive pastestructures; drilling a plurality of holes in at least some of saidhardened conductive paste structures within said apertures associatedwith said electrical conductive paths and pads to enable laterinstallation of one or more electrical components in electrical contactwith said hardened conductive paste structures and said electricalconductive paths and pads; installing said plurality of electricalcomponents into said holes in said hardened conductive paste structuresor in contact with said electrical paths or pads; and installing saidPCB having said plurality of electrical components into an end itemelectrical system at said POU.
 2. The method of claim 1, wherein anexemplary embodiment of said mobile platform is a ship or vehicle. 3.The method of claim 1, wherein an exemplary embodiment of said mobileplatform is combined with a support structure.
 4. The method of claim 1,wherein an alternative exemplary embodiment is applying paste through apneumonic device to fill voids with said paste.
 5. A method ofmanufacturing a printed circuit board (PCB) at a point of use (POU)comprising: determining a plurality of attributes for a PCB at a POUcomprising PCB attributes required for a predetermined plurality ofelectrical components selected for installation at said POU and storingsaid plurality of attributes into a data storage system; retrieving saidplurality of attributes for said PCB and creating a two dimensional (2D)PCB design portion data comprising a one or more 2D PCB structures basedon said plurality of attributes and storing said 2D PCB design portiondata into a first data file stored on a first recording medium section;determining a three dimensional (3D) PCB design portion comprising oneor more 3D PCB structures based on said 2D PCB design portion from saidfirst data file and said plurality of attributes structured for said PCBcomprising one or more steps of associating said one or more 3D PCBstructures with said one or more 2D PCB structures and saving said 3DPCB design into a second data file stored on a second recording mediumsection; inputting the second data file into an additive manufacturing(AM) system adapted to manufacture structures comprising PCB substratesand using said AM system to manufacture one or more PCB substratescomprising a plurality of apertures associated with coupling saidplurality of electrical components with said one or more PCB substrates;applying a plurality of portions of conductive paste into said aperturesin said one or more PCB substrates; hardening said plurality of portionsof conductive paste using a heating system said one or more PCBsubstrates are placed in proximity with; using a drilling system anddrilling holes into said plurality of portions of hardened conductivepaste configured to receive said plurality of electrical components tobe installed in contact with said conductive paste; installing saidplurality of electrical components into said holes created by saiddrilling system; and installing said PCB into end item electrical systemat said POU.
 6. A method as in claim 5, wherein said step of determininga plurality of attributes for said PCB, said step of creating a twodimensional (2D) PCB design portion data, said step of determining athree dimensional (3D) PCB design portion are performed at a differentlocation than said POU and transmitted or communicated to an operator orinto said AM system.
 7. A method of manufacturing a printed circuitboard (PCB) at a point of use (POU) comprising: determining a pluralityof attributes for a PCB at a POU comprising PCB attributes required fora predetermined plurality of electrical components selected forinstallation at said POU and storing said plurality of attributes into adata storage system; retrieving said plurality of attributes for saidPCB and creating a two dimensional (2D) PCB design portion datacomprising a one or more 2D PCB structures based on said plurality ofattributes and storing said 2D PCB design portion data into a first datafile stored on a first recording medium section; determining a threedimensional (3D) PCB design portion comprising one or more 3D PCBstructures based on said 2D PCB design portion from said first data fileand said plurality of attributes structured for said PCB comprising oneor more steps of associating said one or more 3D PCB structures withsaid one or more 2D PCB structures and saving said 3D PCB design portioninto a second data file stored on a second recording medium section;inputting the second data file into an additive manufacturing (AM)system adapted to manufacture structures comprising PCB substrates andusing said AM system to manufacture one or more PCB substratescomprising a plurality of apertures associated with coupling saidplurality of electrical components with said one or more PCB substrates;applying a plurality of portions of conductive paste into said aperturesin said one or more PCB substrates; hardening said plurality of portionsof conductive paste using a heating system said one or more PCBsubstrates are placed in proximity with; using a drilling system anddrilling holes into said plurality of portions of hardened conductivepaste configured to receive said plurality of electrical components tobe installed in contact with said conductive paste; installing saidplurality of electrical components into said holes created by saiddrilling system; and installing said PCB into an end item electricalsystem at said POU; wherein said step of determining a plurality ofattributes for said PCB, said step of creating a two dimensional (2D)PCB design portion data, said step of determining a three dimensional(3D) PCB design portion are performed at a different location than saidPOU and transmitted or communicated to an operator or into said AMsystem.
 8. A method of manufacturing a printed circuit board (PCB) at apoint of use (POU) comprising: forming a printed circuit board (PCB)substrate comprising a plurality of apertures, wherein each saidplurality of apertures are determined and formed into said PCB substratebased on one or more electrical interface sections of one or moreplurality of electrical components selected for coupling with said PCBsubstrate at a later assembly step, wherein said one or more electricalcomponents and said PCB substrate are formed based on a predeterminedend use at a point of use (POU), said predetermined end use comprises aplurality of functions associated with an electrical system includingform, fit, and function attributes associated with said electricalsystem; disposing a plurality of electrical paste sections into saidplurality of apertures; hardening said electrical paste sections;drilling holes into said electrical paste sections configured to receivesaid one or more electrical interface sections; and installing said oneor more electrical interface sections into said plurality of holes andelectrically coupling said electrical interface sections with one ormore electrical conductive paths formed onto or into said PCB substrate.9. An apparatus for manufacturing a PCB comprising: a means of creatinga first data file on a first recording medium in which one embodimentincludes interconnection lists, pad stacks, component footprints, partprofile geometry, and hole diameters; a means of creating a second datafile on a second recording medium in which one embodiment includesdesign rule check and design for manufacturability; a means of creatinga third data file on a third recording medium in which one embodimentincludes a design format interchange (DFX) format for a conductorelement and a drill element; a means of creating a fourth data file on afourth recording medium in which one embodiment includes a mechanicalcomputer aided design (CAD) data format; a means of creating a fifthdata file on a fifth recording medium in which one embodiment includes aconductor three dimensional (3D) model structure and attributes; a meansof creating a sixth data file on a sixth recording medium in which oneembodiment includes the thickness of said PCB to form substrate 3Dmodel; a means of creating a seventh data file on a seventh recordingmedium in which one embodiment includes a plurality of conductor 3Dmodel data; a means of creating an eighth data file on an eighthrecording medium in which one embodiment includes a mechanical CADsystem format comprising a Stereo-Lithographic file (STL) and thencreating geometry attributes to structures of the first substrate andsaving the STL data into another recording medium; a means of applying aplurality of sections of conductive paste to fill in voids or aperturesin substrate; a means of hardening said plurality of sections ofconductive paste in said voids or apertures; a means of creating holesthrough one or more portions of said plurality of sections of conductivepaste; and a means of installing electrical components into said holesin at least some said plurality of sections of conductive paste.
 10. Theapparatus of claim 9, wherein said conductor element includes silver,copper, copper and tin, and foil.
 11. A process for manufacturing aprinted circuit board (PCB) at a point of use (POU) using an additivemanufacturing (AM) system comprising: determining and designing aplurality of two dimensional (2D) forms, fits, and footprints of aplurality of electrical components with respect to a PCB electricalcomponent interfacing design comprising laydown or placements andinterfacing of the electrical components with respect to a PCB substrateincluding electrical interface locations of the electrical componentswith the PCB substrate, creating and associating a plurality of 2Dconductive pad structures in a 2D PCB substrate design with theelectrical interface locations for electrically interfacing theelectrical components with the PCB substrate, creating and associatingconductive lines connecting with the conductive pad structures in thePCB design, and saving the resulting 2D PCB design into a first datafile in an electronic media storage system using a manufacturing systemcomprising a processor, communication system adapted for communicatingwith an external data communication network, the electronic mediastorage system including a PCB design software, one or more input/outputsystems, a processor for executing machine instructions includingprocesses sequences from the PCB design software, and a display at apoint of use or installation into an end component; using a mechanicalcomputer aided design (CAD) system on the manufacturing system to inputthe first data file into the mechanical CAD system and create aresulting three dimensional (3D) PCB design, converting the resulting 2DPCB design from the first data file into a 3D PCB design comprising afirst plurality of 3D apertures or voids in the PCB substrate havingshapes and geometries conforming to 3D representations of the conductivepad structures in the 2D PCB design that will be filled with aconductive paste in a later step, creating a second plurality of 3Dapertures or voids in the PCB substrate associated with mechanicalinterfaces with the PCB substrate, then saving the resulting 3D PCBdesign into a second data file in the electronic media storage system;manufacturing the PCB substrate based on the resulting 3D PCB design inthe second data file using an AM system at the POU comprising the firstand second plurality of 3D apertures or voids; disposing the conductivepaste into the first plurality of apertures or voids and hardening theconductive paste and the POU; drilling electrical interface holes intothe conductive paste sized to the electrical interfaces of theelectronic components using a drill at the POU; installing theelectrical components into the PCB substrate comprising inserting theelectrical interfaces into respective drilled holes in the hardenedconductive paste at the electrical component footprint locations toproduce a completed PCB with installed said electrical components at thePOU; and installing the completed PCB into an end use system at the POU.